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Comparison ledger

-407B-1-S-CES293 Robotversus4-point

ABM -407B-1-S-CES293 Robot, Veeco 4-point, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
4-pointVeeco
OEMABMVeeco
Category——
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyABM -407B-1-S-CES293 RobotVeeco 4-point
Specifications
ModelABM-407B-1-S-CES293[1]—
DescriptionROBOT[1]—
Refurbished RTP RTAAG Associates 4100, 4108, 8108, 8800, 8800i,210, 310, 410, 610, 610I, MPT RTP-600S, 800S, RTP-3000[1]—
KLA-Tencor Spare Parts and ServiceRS-35C,RS-55,RS-75,RS-100,UV-1050,UV-1080,UV-1250,UV-1280,ASET F5 / F5X,AIT Systems,HRP-220 Stylus Profiler[1]—
Refurbished Isotropic Plasma EtcherMatrix, Tegal, Lam Research, Branson/IPC, PlasmaTherm[1]—
Refurbished PECVD, ALD EquipmentCambridge, Oxford PlasmaLab , Plasma-Therm, STS/SPTS, AMAT[1]—
Refurbished Mask AlignerCanon Neutronix PLA501/545, Suss MA200CC, MA8BA8 GEN3, MA8BA8 GEN2, MA8BA8, MA200E[1]—
Refurbished BondingSUSS SB6E, SUSS SB8E, EVG 620 BA, EVG EV501, West Bond 7200AR 7400A[1]—
Refurbished Wafer ProberElectroglas EG 4090u+, EG 4090, EG 2001X, EG 1034X, Cascade PS-21[1]—
Listed in metrology suite—Veeco 4-point probe[2]
Maximum substrate size—6 inch[3]
Measurement capabilities—Sheet resistance, slice resistivity, V/I, metallization thickness, P‑N type testing[4]
Probe mechanism—Wafer is moved into the probe head, not vice versa[4]
Measurement Capabilities—Sheet resistivity, slice resistivity, metallization thickness, P-N type testing[4]
Sources (4)Every fact above is drawn from these public sources
  1. [1]dealer listingsemistarcorp.com
  2. [2]cores.research.asu.educores.research.asu.edu
  3. [3]nnci.netnnci.net
  4. [4]nrf.aux.eng.ufl.edunrf.aux.eng.ufl.edu