Comparison ledger
ABM -407B-2-S-CE-S293 Robot, Besi 2200 EVO Tool Holder, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | ||
|---|---|---|
| OEM | ABM | Besi |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ABM -407B-2-S-CE-S293 Robot | Besi 2200 EVO Tool Holder |
| Cited variants | — | |
| Specifications | ||
| Model | ABM-407B-2-S-CE-S293[2] | 2200 EVO Tool Holder[3] |
| Description | ROBOT[2] | — |
| Refurbished RTP RTA | AG Associates 4100, 4108, 8108, 8800, 8800i,210, 310, 410, 610, 610I, MPT RTP-600S, 800S, RTP-3000[2] | — |
| KLA-Tencor Spare Parts and Service | RS-35C,RS-55,RS-75,RS-100,UV-1050,UV-1080,UV-1250,UV-1280,ASET F5 / F5X,AIT Systems,HRP-220 Stylus Profiler[2] | — |
| Refurbished Isotropic Plasma Etcher | Matrix, Tegal, Lam Research, Branson/IPC, PlasmaTherm[2] | — |
| Refurbished PECVD, ALD Equipment | Cambridge, Oxford PlasmaLab , Plasma-Therm, STS/SPTS, AMAT[2] | — |
| Refurbished Mask Aligner | Canon Neutronix PLA501/545, Suss MA200CC, MA8BA8 GEN3, MA8BA8 GEN2, MA8BA8, MA200E[2] | — |
| Refurbished Bonding | SUSS SB6E, SUSS SB8E, EVG 620 BA, EVG EV501, West Bond 7200AR 7400A[2] | — |
| Refurbished Wafer Prober | Electroglas EG 4090u+, EG 4090, EG 2001X, EG 1034X, Cascade PS-21[2] | — |
| Make | — | Besi / Datacon[3] |
| Asset Number | — | 83809[3] |
| X/Y Placement Accuracy | — | ±10 µm @ 3σ[4] |
| Theta Placement Accuracy | — | ±0.15° @ 3σ[4] |
| Bond Force Range | — | 0.5N to 75N programmable[4] |
| UPH Die Attach | — | up to 7,000 UPH/module[4] |
| UPH Flip Chip with dipping | — | up to 2,500 UPH/module[4] |
| UPH Flip Chip without dipping | — | up to 3,200 UPH/module[4] |
| Machine Dimensions (LxDxH) | — | 1,160 mm x 1,225 mm x 1,750 mm[4] |
| Machine Weight | — | 1,300 kg[4] |
| Uptime | — | > 98%[4] |
| Yield | — | > 99.95%[4] |
| Die Size (Die Attach) | — | 0.17 mm - 50 mm[4] |
| Die Size (Flip Chip) | — | 0.5 mm - 50 mm[4] |
| Die Thickness | — | >50 µm (thinner on request)[4] |
| Wafer Size | — | 4" - 12" (SEMI M1)[4] |
| Frame Size | — | FF070, FF105, FF108, FF123; automatic change (others on request)[4] |
| Substrate Working Range | — | 13" x 8" (325 mm x 200 mm)[4] |
| Bond Head Rotation | — | 0° to 360°[4] |
| Heated Bond Head (optional) | — | up to 450°C[4] |
| UV Curing Wavelengths | — | 365 nm and 405 nm[4] |
| Product type | — | Tool holder[3] |
| Wafer handling | — | 12" wafer handling[4] |
| Integrated dispenser | — | Included[4] |
| Automatic tool changer | — | Included[4] |
| Vintage | — | 2010[5] |