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A WD 300 T Automatic Dicingversus3220

Accretech A WD 300 T Automatic Dicing, Disco 3220, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
3220Disco
OEMAccretechDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAccretech A WD 300 T Automatic DicingDisco 3220
Specifications
ManufacturerAccretech / TSK[1]—
ModelA WD 300 T[1]—
Tool typeAutomatic dicing saw[1]—
Vintage2005[1]—
CategoryDicing & Grinding[2]—
equipment type—dicing saw[3]
Workplace size—ø150 mm[4]
Spindle layout—Single[4]
Spindle output—1.5 kW at 30,000 min-1[4]
Spindle max revolution speed—40,000 min-1[4]
X-axis feed speed range—0.1 – 500 mm/s[4]
Y-axis index step—0.0001 mm[4]
Z-axis repeating accuracy—0.001 mm[4]
Z-axis max blade size—ø58 mm[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]nanofab.utah.edunanofab.utah.edu
  4. [4]semistarcorp.comsemistarcorp.com