Comparison ledger
Accretech , Tokyo Semitsu Kogaku (TSK) UF200, SUSS MicroTec ELP300 Gen2, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | , Tokyo Semitsu Kogaku (TSK) UF200Accretech | ELP300 Gen2SUSS MicroTec |
|---|---|---|
| OEM | Accretech | SUSS MicroTec |
| Category | — | — |
| Wafer size | Wafer Equipment | 300mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | Gen2 |
| Family | Accretech , Tokyo Semitsu Kogaku (TSK) UF200 | SUSS MicroTec ELP300 Gen2 |
| Specifications | ||
| Wafer size | Wafer Equipment[1] | — |
| Date of Manufacture | 1998[1] | — |
| Currently Configured for | 200mm[1] | — |
| Current Equipment Status | Available[1] | — |
| Available date | Currently Available[1] | — |
| Equipment category | Production Wafer Prober[1] | — |
| Automation | — | Automated[2] |
| Wafer Size | — | up to 300 mm[2] |
| Laser Type | — | Excimer Laser[2] |
| Processes | — | Alignment, Ablation, Laser-Assisted Debonding, Laser Seed Layer Removal[2] |