Comparison ledger
Accretech UF 3000 Automatic Wafer, Semics Opus 3, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | UF 3000 Automatic WaferAccretech | Opus 3Semics |
|---|---|---|
| OEM | Accretech | Semics |
| Category | Test & Probe | Test & Probe |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | MS Windows XP Professional |
| Generation | — | — |
| Family | Accretech UF 3000 | Semics Opus |
| Specifications | ||
| Configuration | Hot Nickel Chuck[2] | 15 A[1] |
| Including | MO, HDD[2] | — |
| Voltage | 115 Vac[3] | — |
| Mitigation Spec (HF) | MHF 6000[4] | — |
| Card Holder Material | SUS[4] | — |
| Card Replacement | APC[4] | — |
| Chuck Surface | Kanigen[4] | — |
| Chuck Temp Range | -40℃～150℃[4] | — |
| Tester I/F | GPIB[4] | — |
| Loader Type | 1st[4] | — |
| CPU Type | Advme 7501[4] | — |
| Cleaning Unit Size | 280 x 160 Partially Cut[5] | — |
| Wafer size | 12 inch[10] | — |
| Chuck size | 300mm[3] | — |
| Power requirement | Single Phase, 115 Vac, 2 Wire + Ground[3] | — |
| Included configuration | Hot Nickel Chuck, Right Single Loader, Manipulator, Needle Cleaner (ceramic pad not included), FDD, USB, MO, HDD[2] | — |
| Manufacturer | Accretech / TSK[11] | — |
| Model | UF 3000[11] | — |
| Type | Automatic Wafer Prober[11] | Prober[1] |
| Wafer Sizes | 8 inch, 12 inch[3] | 8 inch, 12 inch[13] |
| Power Supply | — | 200-240 V[1] |
| Full Load Current | — | 11 A[1] |
| Max Ampere Rating | — | 25 A[14] |
| Interruption Capacity | — | 10 kA[14] |
| Power Supply Voltage | — | 200-240 V[1] |
| Power Supply Current | — | 15 A[1] |
| Power Supply Frequency | — | 50/60 Hz[1] |
| Hot Chuck | — | Included[13] |
| Communication Interface | — | GPIB[13] |
| Operating System | — | MS Windows XP Professional[13] |
| Communication | — | GBIP[13] |
| Vintage | — | 2014, 2015, 2016, 2017 (observed units)[1] |
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