Waferpedia

Comparison ledger

7200 Dicingversus18 D Surface

ADT 7200 Dicing, Blanchard 18 D Surface, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
18 D SurfaceBlanchard
OEMADTBlanchard
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones2013 Manufactured—
Control system——
Generation——
FamilyADT 7200 DicingBlanchard 18 D Surface
Cited variants
  • 7200 ProDice[1]
—
Specifications
Model7200[2]18 D[4]
Equipment typeDicing Saw[2]—
Wafer size8 inch[2]—
Vintage2005[2]—
Year of manufacture2013[1]—
Power requirement240V[1]—
ApplicationHigh-accuracy scribing and dicing of silicon wafers, ceramics, glass, and compound semiconductors[1]—
FeaturesPrecision blade spindle; integrated alignment and vision system; motorized X-Y stage; automatic depth control; touchscreen or PC interface[1]—
Voltage—416 V[4]
Phase—3 Phase[4]
Cycles—50[4]
Control Voltage—110[4]
Make—Blanchard[4]
Asset #—153970[4]
Power—416 V, 3 phase[4]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]bidspotter.combidspotter.com
  2. [2]Equipment inventory listing
  3. [3]Equipment inventory listing
  4. [4]inventory listing
  5. [5]Equipment inventory listing