Waferpedia

Comparison ledger

8030 Dicingversus20 36 Surface

ADT 8030 Dicing, Blanchard 20 36 Surface, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
20 36 SurfaceBlanchard
OEMADTBlanchard
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyADT 8030 DicingBlanchard 20 36 Surface
Specifications
Configurationwith ADT AR 927 Water Recycling System[1]With new Elecro-Matic Neutrol II Magnetic Chuck Control[3]
MakeADT[1]—
Model8030[1]—
TypeDicing Saw[1]—
Spindlestwo facing spindles[2]—
Maximum wafer diameter12 in[2]—
Maximum square product size12 in × 12 in[2]—
Water recycling systemADT AR 927 Water Recycling System[1]—
Magnetic Chuck Control—Electro-Matic Neutrol II[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]accelonix.nlaccelonix.nl
  3. [3]inventory listing