Comparison ledger
Applied Materials 0010-13622 RF Match for, Applied Materials Centura 5200 High K, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-13622 RF Match forApplied Materials | Centura 5200 High KApplied Materials |
|---|---|---|
| OEM | Applied Materials | Applied Materials |
| Category | Deposition | Deposition |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-13622 RF Match for | Applied Materials Centura 5200 |
| Specifications | ||
| Configuration | High Efficiency HE RF Match-Bias[1] | Incl gas box and remote frame[2] |
| Model | 0010-13622[1] | Centura 5200 High K[2] |
| Product Type | RF Match for PVD (Physical Vapor Deposition)[1] | — |
| Feature | High Efficiency HE RF Match-Bias[1] | — |
| Manufacturer | — | Applied Materials[2] |
| Wafer size | — | 8 inch[2] |
| Category | — | Deposition[3] |
| Process type | — | Depositing high-k dielectric films[4] |
| Platform family | — | Applied Materials Centura platform family[4] |
| Unit type | — | Single chamber unit, not a complete cluster tool[4] |
| Chamber version | — | 200 mm[5] |
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