Comparison ledger
Applied Materials 0010-13622 RF Match for, Applied Materials Centura 5200 Metal, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-13622 RF Match forApplied Materials | Centura 5200 MetalApplied Materials |
|---|---|---|
| OEM | Applied Materials | Applied Materials |
| Category | Deposition | Deposition |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-13622 RF Match for | Applied Materials Centura 5200 |
| Specifications | ||
| Configuration | High Efficiency HE RF Match-Bias[1] | Ti/TiN MCVD[2] |
| Model | 0010-13622[1] | — |
| Product Type | RF Match for PVD (Physical Vapor Deposition)[1] | — |
| Feature | High Efficiency HE RF Match-Bias[1] | — |
| Process | — | CVD (Chemical Vapor Deposition)[2] |
| Wafer size | — | 8 inch[2] |
| Process chambers | — | Chamber A – MCVD TiN; Chamber B – MCVD TiN; Chamber C – MCVD Ti; Chamber D – MCVD Ti[2] |
| Ti/TiN MCVD | — | 1[3] |
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