Comparison ledger
Applied Materials 0010-13622 RF Match for, CHA 1000, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-13622 RF Match forApplied Materials | 1000CHA |
|---|---|---|
| OEM | Applied Materials | CHA |
| Category | Deposition | Deposition |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-13622 RF Match for | CHA 1000 |
| Specifications | ||
| Configuration | High Efficiency HE RF Match-Bias[1] | 6 Pocket E-gun[2] |
| Model | 0010-13622[1] | — |
| Product Type | RF Match for PVD (Physical Vapor Deposition)[1] | — |
| Feature | High Efficiency HE RF Match-Bias[1] | — |
| System Base Pressure | — | 5x10^-7 Torr[2] |
| Category | — | Deposition[3] |
| Wafer size | — | 5 inch[2] |
| Equipment type | — | Evaporator system[3] |
| E-gun | — | 6-pocket[2] |
| Power supply | — | SR 10 Power Supply[3] |
| Wafer handling | — | Tri Dome System 5" wafers (21 wafers total)[2] |
| Pump down rate | — | to base pressure in under 60 minutes[2] |
| Deposition controller | — | Inficon Deposition Controller[2] |
| Rate controller | — | Inficon Dep Rate Controller[3] |
| Sensor | — | Single Crystal Sensor (Fix Top Mounted)[2] |
| Chamber | — | Water Cooled Chamber[2] |
| Automatic control | — | Automatic Pump Down and Regen Controller[2] |
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