Comparison ledger
Applied Materials 0010-13622 RF Match for, Perkin Elmer 4410, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-13622 RF Match forApplied Materials | 4410Perkin Elmer |
|---|---|---|
| OEM | Applied Materials | Perkin Elmer |
| Category | Deposition | Deposition |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-13622 RF Match for | Perkin Elmer 44xx |
| Specifications | ||
| Configuration | High Efficiency HE RF Match-Bias[1] | Eratron PPS 8210 Plasma Power Supply[2] |
| Model | 0010-13622[1] | 4410 (DeltaTM Cathode Production Sputtering System)[3] |
| Product Type | RF Match for PVD (Physical Vapor Deposition)[1] | — |
| Feature | High Efficiency HE RF Match-Bias[1] | — |
| Type | — | Sputtering Deposition System[3] |
| Manufacturer | — | Perkin-Elmer (Ultek Division)[3] |
| Wafer Size | — | Small~8 inch[4] |
| Process Chamber | — | Load lock[4] |
| Power Supply | — | Eratron PPS 8210 Plasma Power Supply[2] |
| Key Features | — | Process proven for III-V substrates; Non-PLC (smaller footprint / easy maintenance); 20 years proven sputter technology; Process data and recipe storage on a hard drive; Easy TC vacuum gauge calibration; Positioning Deposition (optional); GEM/SEC II functions (optional)[4] |
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