Waferpedia

Comparison ledger

0010-16392 ESC Assemblyversus0010 47763

Applied Materials 0010-16392 ESC Assembly, Applied Materials 0010 47763, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010-16392 ESC AssemblyApplied Materials
0010 47763Applied Materials
OEMApplied MaterialsApplied Materials
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-16392 ESC AssemblyApplied Materials 0010 47763
Specifications
OEMApplied Materials[1]Applied Materials[3]
Model0010-16392[1]0010-47763[3]
TypeESC Assembly[1]Monopolar Dual Heated[4]
Wafer Size300 mm[2]—
Electrode ConfigurationDual[2]—
Configuration—2nd Source New[3]
Description—ASSY, ESC, BONDED, MONOPOLAR DUAL HEATED[5]
Possible Materials—Al2O3 (aluminum oxide) or AlN (aluminum nitride)[4]
Material (possible)—Al2O3 (aluminum oxide) or AlN (aluminum nitride)[4]
Application—Fixing wafers in etching process (PVD, CVD, ETCH)[4]
Quantity available (source)—1[4]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]spwindustrial.comspwindustrial.com
  3. [3]inventory listing
  4. [4]saulcontrol.comsaulcontrol.com
  5. [5]getspares.comgetspares.com