Comparison ledger
Applied Materials 0010-16392 ESC Assembly, Lam Research 2300 Versys Kiyo, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-16392 ESC AssemblyApplied Materials | 2300 Versys KiyoLam Research |
|---|---|---|
| OEM | Applied Materials | Lam Research |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-16392 ESC Assembly | Lam Research 2300 Versys Kiyo |
| Cited variants | — | |
| Specifications | ||
| OEM | Applied Materials[3] | — |
| Model | 0010-16392[3] | — |
| Type | ESC Assembly[3] | — |
| Wafer Size | 300 mm[4] | 300mm (12 inch)[1] |
| Electrode Configuration | Dual[4] | — |
| Configuration (Kiyo 2300 V2) | — | 4 Kiyo CX chambers, 3 load ports, ATM robot with one end effector, VTM robot with dual end effectors, software version SP15-HF6, communication protocols RS232 and LON[1] |
| Application | — | Polysilicon Etch[1] |
| Plasma Source | — | Dual-frequency CCP[6] |
| Power System | — | 3kW RF generator with independent bias and source tuning[6] |
| Gas Configuration | — | Up to 10 gas lines, including reactive gases (CF₄, Cl₂, HBr) and radicals (O₂, N₂)[6] |
| Throughput | — | 60–100 wafers/hour (node-dependent)[6] |
| Wafer Cooling | — | ESC with ±1°C stability[6] |
| Aspect Ratio Capability | — | >30:1[6] |
| Chamber Design | — | Dual-chamber configuration with isolated process and exhaust zones[6] |
| Plasma Source Frequencies | — | 13.56 MHz + 2 MHz[6] |
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