Comparison ledger
Applied Materials 0010-18024 Pyrometer Assembly, Dektak 8, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-18024 Pyrometer AssemblyApplied Materials | 8Dektak |
|---|---|---|
| OEM | Applied Materials | Dektak |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-18024 Pyrometer Assembly | Dektak 8 |
| Specifications | ||
| Configuration | Capable of working on Applied Materials Radiance[1] | — |
| Measurement Technique | — | Stylus profilometry[2] |
| Scan Length Range | — | 50 mm (2 in.) standard; 100 mm (4 in.) optional[2] |
| Max Wafer Size | — | 200 mm (8 in.)[2] |
| Step Height Repeatability | — | 7.5 Å, 1 sigma on 1 μm step[2] |
| Vertical Range | — | 262 μm standard; 1 mm optional[2] |
| Vertical Resolution | — | 1 Å max (@ 6.55 μm range)[2] |
| Max Sample Thickness | — | 25.4 mm (1 in.)[2] |
| Stylus Force | — | 1 to 15 mg with standard LIS 3; 0.03 to 15 mg with N-Lite sensor option[2] |
| Stylus Options | — | Stylus radius options from 0.2 to 25 μm; Super Sharp 50 nm stylus for use with N-Lite; High Aspect Ratio (HAR) tips for 10 μm D x 2 μm W trenches or 200 μm D x 20 μm W trenches[2] |
| Dimensions (W x D x H) | — | 457 mm x 610 mm x 483 mm (18 in. x 24 in. x 19 in.)[2] |
| Weight | — | 48 kg (105 lbs)[2] |
| Input Voltage | — | 100-120 VAC / 200-240 VAC, 50-60 Hz[2] |
| Temperature Range | — | 15 to 30 °C (59 to 86 °F)[2] |
| Humidity Range | — | ≤ 80%, non-condensing[2] |
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