Comparison ledger
Applied Materials 0010-22161 High EFF RF Match, Applied Materials UVision 200, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-22161 High EFF RF MatchApplied Materials | UVision 200Applied Materials |
|---|---|---|
| OEM | Applied Materials | Applied Materials |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-22161 High EFF RF Match | Applied Materials UVision 200 |
| Specifications | ||
| Make | Applied Materials[1] | Applied Materials[3] |
| Model | 0010-22161[1] | UVision 200[3] |
| Description | HTESC PH 1 REV A[2] | — |
| Condition | Used[2] | — |
| Stock Number | BM6628[2] | — |
| Wafer Sizes | — | 12 inch[3] |
| Type | — | brightfield inspection system[4] |
| Frequency | — | 60 Hz[4] |
| Wafer handling | — | 300/200mm end effector[4] |
| Configuration option | — | Isoport[4] |
| Startup specification | — | Standard start up spec[4] |
| Option | — | OHT P I/O sensor for E84 (Hokuyo) L=5m[4] |