Comparison ledger
Applied Materials 0010-22161 High EFF RF Match, KLA Surfscan 6200, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-22161 High EFF RF MatchApplied Materials | |
|---|---|---|
| OEM | Applied Materials | KLA |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-22161 High EFF RF Match | KLA Surfscan 6200 |
| Specifications | ||
| Make | Applied Materials[1] | — |
| Model | 0010-22161[1] | — |
| Description | HTESC PH 1 REV A[2] | — |
| Condition | Used[2] | — |
| Stock Number | BM6628[2] | — |
| Wafer Sizes Supported | — | 50mm (2"), 76mm (3"), 100mm (4"), 125mm (5"), 150mm (6"), 200mm (8")[3] |
| Defect Sensitivity | — | 0.10 µm diameter PSL sphere equivalent with greater than 90% capture rate[3] |
| Defect Sensitivity (alternative) | — | 0.12 µm[4] |
| Illumination Source | — | 30 mW Argon-Ion laser, 488 nm wavelength[3] |
| Haze Sensitivity | — | 0.02 ppm[3] |
| Haze Resolution | — | 0.002 ppm[3] |
| Repeatability | — | 0.5% at 1σ (mean count >500, 0.364 µm latex spheres)[3] |
| Accuracy | — | ≥99% (verified with VLSI Standards)[3] |
| Dynamic Range | — | 0.01 µm to 9,999 µm in a single measurement[3] |
| Throughput | — | Up to 100 w/hr using 150mm wafers[3] |
| Cassette Handling | — | Single puck wafer handling from two cassette (one sender/receiver, one receiver)[3] |
| Operating System / Software | — | Microsoft Windows 98, version 4.2[4] |
| Dimensions (H x W x D) | — | 168 cm x 75 cm x 77 cm (66" x 29.5" x 30.25")[3] |
| Weight | — | 240 kg (530 lbs)[3] |