Comparison ledger
Applied Materials 0010-22161 High EFF RF Match, KLA UV 1250 SE Thin Film Thickness Measurement, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-22161 High EFF RF MatchApplied Materials | |
|---|---|---|
| OEM | Applied Materials | KLA |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-22161 High EFF RF Match | KLA UV 1250 SE |
| Specifications | ||
| Make | Applied Materials[1] | KLA[5] |
| Model | 0010-22161[1] | UV 1250 SE[5] |
| Description | HTESC PH 1 REV A[2] | wafer film measurement instrument; ellipsometer[6] |
| Condition | Used[2] | — |
| Stock Number | BM6628[2] | — |
| Configuration | — | Open casette[3] |
| KLA PN | — | 28-0144 has been removed[4] |
| Wafer size | — | 8 inch[3] |
| Open cassette | — | Open casette[6] |
| Windows NT software version | — | 4.0.1381[3] |
| Summit software version | — | 2.62.06[3] |
| Tester firmware version | — | 3.1.0[3] |
| Maker | — | KLA[5] |
| Wafer handling | — | Open cassette[6] |
| Software | — | Windows NT software version 4.0.1381; Summit software version 2.62.06[3] |
| Tester firmware | — | 3.1.0[3] |
| Control software | — | Windows NT software version 4.0.1381; Summit software version 2.62.06[3] |