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0010-22161 High EFF RF MatchversusNanospec 3000

Applied Materials 0010-22161 High EFF RF Match, Onto Innovation Nanospec 3000, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
Nanospec 3000Onto Innovation
OEMApplied MaterialsOnto Innovation
Category——
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-22161 High EFF RF MatchOnto Innovation Nanospec 3000
Specifications
MakeApplied Materials[1]—
Model0010-22161[1]—
DescriptionHTESC PH 1 REV A[2]—
ConditionUsed[2]—
Stock NumberBM6628[2]—
Wavelength range—480-800 nm[3]
Wavelength range (alternative)—400-800 nm[4]
Film thickness range—250 A to 35 µm[3]
Film thickness range (alternative)—100A up to 20um (resolution 50A)[4]
Maximum film thickness—30µm[4]
Measurement spot size—25 µm[3]
Measurement spot size (alternative)—25um, down to 100nm at 40X objective[4]
Measurement time—0.25 s to 4 s / site[3]
Measurement time (alternative)—less than 3 seconds[4]
Number of layers—3[3]
Number of layers (alternative)—up to 3 films[4]
Detector—Linear diode array detector[3]
Reproducibility—<2 A[3]
Wafer size—3"-6"[3]
Wafer size (alternative)—up to 6"/150mm[4]
Objective magnifications—5X, 10X (default), 50X[5]
Spot size per objective—5X: 50 µm; 10X: 25 µm; 50X: 5 µm[5]
Sources (5)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]tarasemi.comtarasemi.com
  3. [3]tech-semi.comtech-semi.com
  4. [4]semistarcorp.comsemistarcorp.com
  5. [5]nanofab.utah.edunanofab.utah.edu