Waferpedia

Comparison ledger

0010-22161 High EFF RF MatchversusPowermax30 XP

Applied Materials 0010-22161 High EFF RF Match, Plasma-Therm Powermax30 XP, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
Powermax30 XPPlasma-Therm
OEMApplied MaterialsPlasma-Therm
Category——
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-22161 High EFF RF MatchPlasma-Therm Powermax30 XP
Specifications
MakeApplied Materials[1]—
Model0010-22161[1]—
DescriptionHTESC PH 1 REV A[2]—
ConditionUsed[2]—
Stock NumberBM6628[2]—
Product line—Powermax[3]
Type—Plasma cutting and gouging system[3]
Portability—Portable[3]
Usage—Handheld and automated[3]
Sources (3)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]tarasemi.comtarasemi.com
  3. [3]hypertherm.comhypertherm.com