Comparison ledger
Applied Materials 0010-22161 High EFF RF Match, SCREEN SU 3200 Single Wafer Processing, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-22161 High EFF RF MatchApplied Materials | |
|---|---|---|
| OEM | Applied Materials | SCREEN |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-22161 High EFF RF Match | SCREEN SU 3200 |
| Specifications | ||
| Make | Applied Materials[1] | — |
| Model | 0010-22161[1] | — |
| Description | HTESC PH 1 REV A[2] | — |
| Condition | Used[2] | — |
| Stock Number | BM6628[2] | — |
| Configuration | — | 12 Chamber Aquaspin[3] |
| Factory Interface | — | FOUP (4)[3] |
| Handler System | — | Kawasaki[3] |
| Software Version | — | Standard[3] |
| CIM | — | SECS / GEMS[3] |
| Process | — | SOM / SPM / SC1/ SC2 / 03W / DHF[3] |
| Software version | — | P2485STD00V2485STD00[4] |
| System power rating | — | 208AC-3 Phase[4] |
| Wafer size | — | 12 inch (300 mm)[3] |
| Maximum chambers | — | 12 chambers in four three-level towers[5] |
| Throughput | — | up to 800 wafers per hour (WPH)[5] |
| Chemical supply options | — | dynamic direct injection (DDI) or cabinet-type chemical supply system[5] |
| Chamber volume reduction | — | about one-third of the previous model[5] |
| Processes | — | SOM / SPM / SC1/ SC2 / 03W / DHF[3] |
| Power rating | — | 208AC-3 Phase[4] |