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0010-22161 High EFF RF MatchversusDelta 12 AQ Spin

Applied Materials 0010-22161 High EFF RF Match, SUSS MicroTec Delta 12 AQ Spin, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
0010-22161 High EFF RF MatchApplied Materials
Delta 12 AQ SpinSUSS MicroTec
OEMApplied MaterialsSUSS MicroTec
Category——
Wafer size——
Process node——
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FamilyApplied Materials 0010-22161 High EFF RF MatchSUSS MicroTec Delta 12 AQ Spin
Specifications
MakeApplied Materials[1]—
Model0010-22161[1]—
DescriptionHTESC PH 1 REV A[2]—
ConditionUsed[2]—
Stock NumberBM6628[2]—
Maximum wafer diameter—200 mm[3]
Maximum substrate thickness—5 mm[3]
Supported wafer diameters—50 mm, 75 mm, 100 mm, 150 mm, 200 mm[3]
Supported photomask sizes—125 mm x 125 mm, 150 mm x 150 mm[3]
Supported developer chemistries—AZ400K, AZ300MIF, CD26[3]
Operation type—Recipe controlled automated operation[3]
Developer temperature control—Precise control[3]
Substrate handling—Cassette-to-cassette dry in-dry out[3]
0010-22161 High EFF RF Match entryDelta 12 AQ Spin entryAsk about these tools →Share experience with this comparison →
Sources (3)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]tarasemi.comtarasemi.com
  3. [3]nist.govnist.gov