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0010-47763 ASSY ESC Bonded Monopolar Dual HeatedversusConnX Elite

Applied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual Heated, Kulicke & Soffa ConnX Elite, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
ConnX EliteKulicke & Soffa
OEMApplied MaterialsKulicke & Soffa
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual HeatedKulicke & Soffa Connx
Cited variants—
  • ConnX ELITE Opto LA (Large Area)[1]
  • ConnX ELITE Opto ELA (Extended Large Area)[1]
  • ConnX ELITE Opto LA[2]
  • ConnX ELITE Opto ELA[2]
Specifications
ConfigurationRefurbished[3]50/60 Hz[4]
Bondable area—56 x 80 mm[5]
Placement accuracy—3 µm (3 sigma)[6]
Bonding method—Wire Bonder[6]
Bonding wire length—5 mm[6]
Die pad downset—Up to 2.3 mm[6]
Gold wire size—25.4 µm[6]
Leadframe dimensions—300 x 92 mm[6]
Magazine dimensions—305 x 98 x 178 mm[6]
Minimum loop height—65 µm[6]
Wire pitch—1.27 to 25 mm[6]
Wire sway—25 µm[6]
Air consumption—185 L/min[6]
Air pressure—3.52 kg/sq cm[6]
Power supply—200-240 VAC, -15% to 10%, Single Phase, 50/60 Hz, 2.6 KVA[6]
Net weight—556 kg[6]
Overall dimensions—Base Machine with MHS x 889 x 990 mm[6]
Type—high-speed automatic wire bonder[2]
Category—Packaging & Bonding[2]
Power—50/60 Hz[4]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]zaratech.bizzaratech.biz
  2. [2]waferpedia.comwaferpedia.com
  3. [3]inventory listing
  4. [4]inventory listing
  5. [5]kns.comkns.com
  6. [6]semiconductor.directorysemiconductor.directory