Comparison ledger
Applied Materials 0010 47763, Oxford Instruments Plasmalab 100 ICP-RIE, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010 47763Applied Materials | Plasmalab 100 ICP-RIEOxford Instruments |
|---|---|---|
| OEM | Applied Materials | Oxford Instruments |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010 47763 | Oxford Instruments Plasmalab 100 |
| Specifications | ||
| Configuration | 2nd Source New[1] | RF source 300 W, 13.56 MHz[4] |
| Type | Monopolar Dual Heated[2] | — |
| Description | ASSY, ESC, BONDED, MONOPOLAR DUAL HEATED[3] | — |
| Possible Materials | Al2O3 (aluminum oxide) or AlN (aluminum nitride)[2] | — |
| Model | 0010-47763[1] | — |
| OEM | Applied Materials[1] | — |
| Material (possible) | Al2O3 (aluminum oxide) or AlN (aluminum nitride)[2] | — |
| Application | Fixing wafers in etching process (PVD, CVD, ETCH)[2] | — |
| Quantity available (source) | 1[2] | — |
| Process gases used | — | H2, O2, N2, Ar, CF4, SF6, CHF3, He, CH4, HBr, Cl2 and BCl3[4] |
| Cryo Table w/ operating temp | — | -150 to 400C[4] |
| Substrate cooling | — | using liquid nitrogen (LN2)[4] |
| Base pressure | — | 5E-7 Torr[4] |
| Main Chamber Backing Pump | — | Adixen ADP 122P Dry pump[4] |
| Main Chamber Turbo Pump | — | Adixen ATH 1300 Turbo[4] |
| Load Lock | — | Adixen ACP 15G Dry pump[4] |
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