Waferpedia

Comparison ledger

0020 12458 PartversusCentura Ultima+ HDP

Applied Materials 0020 12458 Part, Applied Materials Centura Ultima+ HDP, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0020 12458 PartApplied Materials
Centura Ultima+ HDPApplied Materials
OEMApplied MaterialsApplied Materials
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0020 12458 PartApplied Materials Centura
Specifications
ConfigurationInsulator,Side Match,Hdp-Cvd Ultima Plus[1]Ch A – Ultima+ (ENI AM200 RF Generator)[2]
Asset number146526[1]—
MakeApplied Materials[1]—
Model0020 12458[1]—
Wafer Size (Ultima+ HDP)—6 inch[2]
RF Generator (Ch A)—ENI AM200[2]
Multi-slot cooldown (Ch E)—Present[2]
Platform & Chamber Model—Centura Ultima[3]
Wafer Size (Platform support)—200mm and 300mm[3]
Process Chambers—2[3]
Remote Plasma Source—MKS iAstron[3]
Electrostatic Chuck—Ceramic with backside He, water cooling, wafer temperature monitor[3]
Gas Ring—Ceramic gas nozzles[3]
Center Gas Nozzle/Baffle—Present[3]
Factory Interface Robot—Kawasaki[3]
Load Ports—2[3]
Mainframe—4.0 with metal buffer lid[3]
RF Generators—Top, Side, and Bias[3]
Vacuum System - Throttle Valve—Stepper Turbo Throttle Valve with 3 veins[3]
Vacuum System - Gate Valve—Pendulum Gate Valve[3]
Vacuum System - Turbo Pump—Present[3]
Gas Boxes—15 stick AP Gas Boxes (incl. Methane line)[3]
Endpoint Detector—Foreline FTIR[3]
Foreline—Heater Jacketed[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]media-moov-co.s3.us-west-1.amazonaws.commedia-moov-co.s3.us-west-1.amazonaws.com