Waferpedia

Comparison ledger

0020 23839 Partversus6164

Applied Materials 0020 23839 Part, Perkin Elmer 6164, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0020 23839 PartApplied Materials
6164Perkin Elmer
OEMApplied MaterialsPerkin Elmer
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0020 23839 PartPerkin Elmer 6164
Specifications
ConfigurationPlate, Sensor Clamp, Hdpcvd Ultima +[1]Metal deposition[2]
Gases—nitrogen, CDA[2]
Nitrogen consumption—30PSI[2]
Exhaust—for pumps only[2]
Voltage—208V, 100A[2]
Make—Perkin Elmer[2]
Model—6164[2]
Equipment type—Sputtering system[2]
Process—Metal deposition[2]
Wafer size—6 inch[2]
Power—208V, 100A[2]

Plan your fab

Building a Deposition process? Get a complete equipment list.

Open the fab equipment planner →
Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing