Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, ASM AB 559 A 06 Wedge, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | |
|---|---|---|
| OEM | Applied Materials | ASM |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | ASM AB 559 |
| Specifications | ||
| Configuration | — | 50/60 Hz[1] |
| Software vs | — | 2.42[2] |
| Machine type | — | Wedge Bonder[1] |
| Make | — | ASM[1] |
| Model | — | AB 559 A 06[1] |
| Frequency | — | 50/60 Hz[1] |
| Voltage | — | 240 Volts[1] |
| Vintage | — | 2005[1] |
| Software version | — | 2.42[2] |
Plan your fab
Building a Packaging & Bonding process? Get a complete equipment list.
Open the fab equipment planner →