Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, ASM Eagle Aero, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | Eagle AeroASM |
|---|---|---|
| OEM | Applied Materials | ASM |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | ASM Eagle Aero |
| Cited variants | — |
|
| Specifications | ||
| Voltage | — | 110 VAC[2] |
| Configuration | — | Single phase[2] |
| Equipment Type | — | Automatic ball wire bonding system[3] |
| Bonding Technology | — | Thermosonic with X-Power[1] |
| Transducer | — | Aeroducer dual frequency (X and Y direction)[1] |
| Bonded Ball Size | — | 22 µm[1] |
| Wire Size | — | 0.5 mil[1] |
| UPH Improvement | — | Up to 30% for typical Cu wire application[1] |
| Wire Materials | — | Copper wire, gold wire and compatible materials[3] |
| Application | — | High-end IC semiconductor packaging[1] |
| Power Requirements | — | 110 VAC, Single phase, 50/60Hz[2] |
| Optical System | — | Dual magnification optical path, dual-color coaxial light[4] |
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