Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, Besi 2200 EVO Plus, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | 2200 EVO PlusBesi |
|---|---|---|
| OEM | Applied Materials | Besi |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | Besi 2200 |
| Specifications | ||
| Configuration | — | Buffer Line Input[1] |
| Make | — | Besi / Datacon[2] |
| Model | — | 2200 EVO Plus[2] |
| Bond Force | — | 0.5N to 75N programmable[3] |
| X/Y placement accuracy | — | ± 7 µm @ 3s[3] |
| Theta placement accuracy | — | ± 0.10° @ 3s[3] |
| Die attach throughput | — | up to 7,000 UPH/module[3] |
| Flip chip throughput with dipping | — | up to 2,500 UPH/module[3] |
| Flip chip throughput without dipping | — | up to 3,200 UPH/module[3] |
| Heated bond head | — | up to 450°C (optional)[3] |
| UV curing | — | 365 nm & 405 nm[3] |
| Machine dimensions (LxDxH) | — | 1,160 mm x 1,225 mm x 1,750 mm[3] |
| Weight | — | 1,300 kg[3] |
| Wafer size | — | 4" - 12" (SEMI M1)[3] |
| Frame size | — | FF070, FF105, FF108, FF123; automatic change (others on request)[3] |
| Substrate working range | — | 13” x 8” (325 mm x 200 mm)[3] |
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