Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, Datacon 2200, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | 2200Datacon |
|---|---|---|
| OEM | Applied Materials | Datacon |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | 1995 |
| Production run | — | 1995– |
| Lifecycle | — | — |
| Lifecycle milestones | — | 1995 Platform introduction |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | Datacon 2200 |
| Cited variants | — |
|
| Specifications | ||
| Product type | — | Multi Chip Die Bonder[1] |
| Platform basis | — | Based on Datacon's previous PPS 2200 Multi Chip Die Bonder platform[1] |
| System description | — | Revolutionary modular system[1] |
| Flexibility | — | Extraordinary flexibility with minimum space requirements[1] |
| Application conversion | — | Conversion between different applications is done fast and simply[1] |
| Developed for | — | Demanding advanced packaging market[1] |
| Features & highlights | — | Automatic Tool Changer System; Automatic Wafer Handling System; Flip Chip Unit; Needle Ejector System; Processing of Epoxy, Flux and Solder Paste; Software Features & Options; Tape Feeder[1] |
| Connection technologies | — | Flip chip, die attach, or combination[1] |
| Automatic Tool Changer System | — | Feature included[1] |
| Automatic Wafer Handling System | — | Feature included[1] |
| Flip Chip Unit | — | Feature included[1] |
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