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Comparison ledger

0041-26723 Bonded Assemblyversus4124 Gold Ball

Applied Materials 0041-26723 Bonded Assembly, Kulicke & Soffa 4124 Gold Ball, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
4124 Gold BallKulicke & Soffa
OEMApplied MaterialsKulicke & Soffa
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0041-26723 Bonded AssemblyKulicke & Soffa 4124
Specifications
Configuration—Incomplete, for parts[1]
Manufacturer—Kulicke & Soffa[2]
Model—4124[1]
Type—gold ball bonder[2]
Bonding wire material—gold[3]
Wire diameter range—0.7 to 3.0 mils (17 to 75 microns)[3]
Cycle time—900 ms (including 100 ms bond time)[3]
Bond force—5 to 160 gr[3]
Bond time—10 to 100 ms[3]
Ultrasonic power, low range—1.3 W max[3]
Ultrasonic power, high range—2.0 W max[3]
EFO voltage—1200 Vdc, adjustable ball size[3]
Throat depth—5 in (127 mm)[3]
Reset to overtravel overall range—0.33 in (8.38 mm)[3]
Search/loop height range—0.02 in (0.51 mm) under reset to 0.02 in (0.51 mm) above lowest overtravel[3]
Table motion, gross—6.5 in (165 mm) diameter[3]
Table motion, fine—0.5 in (12.7 mm) diameter[3]
Bonding area—3.75 in x 3.75 in (95 mm x 95 mm)[3]
Chessman ratio—6:1[3]
Tail length—constant, electronically adjustable[3]
Optics—B&L or WILD stereo zoom microscope, top mounted[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]clara.nzclara.nz