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0041-26723 Bonded AssemblyversusCB 200 M Wafer

Applied Materials 0041-26723 Bonded Assembly, SUSS MicroTec CB 200 M Wafer, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
0041-26723 Bonded AssemblyApplied Materials
CB 200 M WaferSUSS MicroTec
OEMApplied MaterialsSUSS MicroTec
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0041-26723 Bonded AssemblySUSS MicroTec CB 200 M Wafer
Specifications
Wafer Size—8 inch[1]
Category—Packaging & Bonding[2]
Vintage—2012[1]
Type—Wafer Bonder[1]
0041-26723 Bonded Assembly entryCB 200 M Wafer entryAsk about these tools →Share experience with this comparison →

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Sources (2)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]waferpedia.comwaferpedia.com