Waferpedia

Comparison ledger

0720 06060 PartversusSST C 421 280 Batch Wafer Processing

Applied Materials 0720 06060 Part, Semitool SST C 421 280 Batch Wafer Processing, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0720 06060 PartApplied Materials
OEMApplied MaterialsSemitool
CategoryTest & ProbeTest & Probe
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0720 06060 PartSemitool SST C 421 280 Batch Wafer Processing
Specifications
ConfigurationContact Pin 24-20 Awg Crimp Gold Flash[1]—
Wafer Size—6 inch[2]
Vintage—2004[4]
Power—208 VAC[4]
Full Load Current—30 A[3]
Largest Motor or Load—10 A (15 HTR)[3]
Short Circuit Interrupt—10,000 A[3]
Heat Exchanger—Present[4]
Vacuum—Present[4]
CDA—65–70 PSI[4]
DI Water—35 PSI Minimum[4]
Process Gas—N₂ / CO₂[4]
Condition Note—Visible Corrosion on Modules[4]
Missing Components—Wafer Handler, Power Supply, AC Distribution Box, External Transformer, UPS, Backing Pump(s), Shipping Brackets[4]
Voltage—208 VAC[3]
Phase—3 Phase[3]
Wafer Sizes—6 inch, 8 inch (200mm)[3]
CDA Pressure—65–70 PSI[4]
DI Water Pressure (Minimum)—35 PSI[4]
Manufacturer—Semitool[3]
Model—SST C 421 280[3]
Frequency—50/60 Hz[3]
DI water pressure—35 PSI minimum[4]
Version—200mm[5]
Sales condition—as is where is[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]Equipment inventory listing
  3. [3]Equipment inventory listing
  4. [4]Equipment inventory listing
  5. [5]fabsurplus.comfabsurplus.com