Waferpedia

Comparison ledger

Centura AP DPS Dryversus200 ACU

Applied Materials Centura AP DPS Dry, Axcelis 200 ACU, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
Centura AP DPS DryApplied Materials
200 ACUAxcelis
OEMApplied MaterialsAxcelis
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials Centura AP DPS DryAxcelis NV GSD 200
Specifications
Wafer Size12 inch[1]—
CategoryEtch[2]—
TypeDry Etcher[1]—
Vintage2005[1]—
Configuration—Parts Machine[3]
Manufacturer—Axcelis[3]
Model—200 ACU[3]
Tool type—Asher[3]
Wafer size—200mm[5]
Serial number—AU6A356AH[5]
Computer system—M 200 PC, M 200[6]
Part number—SC 4572 A[6]
Volts—208[6]
Amps—30[6]
Equipment type—Asher[3]
Wafer configuration—8 inch[4]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]inventory listing
  4. [4]semistarcorp.comsemistarcorp.com
  5. [5]wotol.comwotol.com
  6. [6]semistarcorp.comsemistarcorp.com