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Comparison ledger

Centura eMax Nitrideversus200 ACU

Applied Materials Centura eMax Nitride, Axcelis 200 ACU, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
Centura eMax NitrideApplied Materials
200 ACUAxcelis
OEMApplied MaterialsAxcelis
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials CenturaAxcelis NV GSD 200
Specifications
Configuration2 Chamber Emax[1]Parts Machine[2]
GasCF4, CH2F2, CHF3, Ar, O2, N2[1]—
OSAMAT Legacy[1]—
Buffer RobotHP[1]—
Chiller 1AMAT Endura HX 18706-01[1]—
Chiller 2Thermo Electron HX 150 106178026[1]—
Wafer size8 inch[1]200mm[4]
Chamber configuration2 Chamber Emax; 1 Orienter/degas[1]—
Gas chemistryCF4, CH2F2, CHF3, Ar, O2, N2[1]—
Operating systemAMAT Legacy[1]—
Chamber #AeMAX[1]—
Chamber #BeMAX[1]—
Chamber #CEMPTY[1]—
Chamber #DEMPTY[1]—
Chamber #EEMPTY[1]—
Chamber #FOrienter[1]—
Manufacturer—Axcelis[2]
Model—200 ACU[2]
Tool type—Asher[2]
Serial number—AU6A356AH[4]
Computer system—M 200 PC, M 200[5]
Part number—SC 4572 A[5]
Volts—208[5]
Amps—30[5]
Equipment type—Asher[2]
Wafer configuration—8 inch[3]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]semistarcorp.comsemistarcorp.com
  4. [4]wotol.comwotol.com
  5. [5]semistarcorp.comsemistarcorp.com