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Comparison ledger

Centura TPCC RTP XE+versus100 ICP Fluorine

Applied Materials Centura TPCC RTP XE+, Oxford Instruments 100 ICP Fluorine, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
Centura TPCC RTP XE+Applied Materials
100 ICP FluorineOxford Instruments
OEMApplied MaterialsOxford Instruments
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials Centura TPCCOxford Instruments 100 ICP Fluorine
Specifications
CH AXE+ Non-Toxic ATM[1]—
ConfigurationChemraz O-Ring[1]—
Edge RingS2[1]—
Bearing TypeStandard[1]—
CH BEmpty[1]—
CH CEmpty[1]—
CH DEmpty[1]—
CH ESingle Slot Fast Cooldown[1]—
CH FSingle Slot Fast Cooldown[1]—
Gas Line PurgeN2-10 SLM[1]—
Gas Line 102-10 SLM[1]—
Wafer Size8 inch[1]—
Chamber A ConfigurationXE+ Non-Toxic ATM - Chemraz O-Ring - RGA Port and Valve - MWBC - Edge Ring: S2 Bearing Type: Standard[1]—
Chamber E and F ConfigurationSingle Slot Fast Cooldown[1]—
RobotAsyst LPT2200 SMIF Robot[1]—
ControllerVita Computer Controller (Modular Controller)[1]—
Gas Delivery10 Ra Gas Panel, Top Feed Gas Line Input, Multiple Line Drop Gas Distribution, Gas Line Purge: N2-10 SLM, Gas Line 1: O2-10 SLM, Gas Line 2: N2-20 SLM, Gas Line 3: O2 1 SLM, STEC Z500 MFC Type First Manifold[1]—
Heat ExchangerSMC 40 GPM Stainless Steel Heat Exchanger[1]—
Gas Line 2N2-20 SLM[1]—
Gas Line 302 1SLM SLM[1]—
Gas Line 4None[1]—
Etch Gases—SF6, CF4, O2, Ar, N2, CHF3, C4F8[2]
Cryo DRIE etch rate—up to 5 µm/min[2]
Wafer size—4 inch, 6 inch, 8 inch (with clamp change)[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]nanofab.utah.edunanofab.utah.edu