Waferpedia

Comparison ledger

Producer GTversus200 ACU

Applied Materials Producer GT, Axcelis 200 ACU, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
Producer GTApplied Materials
200 ACUAxcelis
OEMApplied MaterialsAxcelis
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run2006–—
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials ProducerAxcelis NV GSD 200
Cited variants
  • Applied Materials Producer GT Etcher[1]
  • Applied Materials (AMAT) Producer GT APF[2]
—
Specifications
Chamber ASiCoNi[1]—
Chamber BFrontier Etch[1]—
ConfigurationMissing:[1]Parts Machine[5]
OEMApplied Materials[3]—
ModelProducer GT[3]200 ACU[5]
Wafer size12 inch[3]200mm[7]
Chamber namesA, B, C[2]—
Current equipment statusIncoming[2]—
Date of manufacture2009-01-01[2]—
Configured wafer size300mm[2]—
System power rating110 AC 3-Phase for system[2]—
Loading configuration3 LP / 7 cooling station / 25 wafer FOUP[2]—
Process capabilityAdvanced lithography and etch patterning down to the 22nm technology node[4]—
Manufacturer—Axcelis[5]
Tool type—Asher[5]
Serial number—AU6A356AH[7]
Computer system—M 200 PC, M 200[8]
Part number—SC 4572 A[8]
Volts—208[8]
Amps—30[8]
Equipment type—Asher[5]
Wafer configuration—8 inch[6]

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Sources (8)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]macquarie.commacquarie.com
  3. [3]Equipment inventory listing
  4. [4]marketscreener.commarketscreener.com
  5. [5]inventory listing
  6. [6]semistarcorp.comsemistarcorp.com
  7. [7]wotol.comwotol.com
  8. [8]semistarcorp.comsemistarcorp.com