Comparison ledger
Applied Materials UVision 3 Brightfield, KLA 0035235-003 MMD Head, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | UVision 3 BrightfieldApplied Materials | |
|---|---|---|
| OEM | Applied Materials | KLA |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials UVision | KLA 0035235-003 MMD Head |
| Specifications | ||
| Loading Configuration | FOUP, 2 Positions[1] | — |
| Configuration | Loadport - ASYST Isoport[1] | TSTD PCB ASSY, MMD MEAS HEAD[5] |
| Operating Software | Windows XP[2] | — |
| SW Version | 7.5 I[1] | — |
| Inspection type | Brightfield inspection[1] | — |
| Illumination source | DUV (deep ultraviolet) laser[3] | — |
| Throughput advantage | 40% faster than any competitive brightfield inspection tool[3] | — |
| Defect detection sensitivity | 45nm FEOL and immersion lithography[3] | — |
| Laser architecture | Multi-beam DUV laser architecture[3] | — |
| Wafer size | 300mm[4] | — |
| Loading configuration | FOUP-based[2] | — |
| Model | — | 0035235-003[5] |
| Make | — | KLA[5] |
| Part Description | — | TSTD PCB ASSY, MMD MEAS HEAD[5] |
| Compatible System | — | KLA AIT-XP[5] |
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