Comparison ledger
ASM AD 838 L, MRSI HVM3, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | AD 838 LASM | HVM3MRSI |
|---|---|---|
| OEM | ASM | MRSI |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | Wafer Loader | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | 2018– |
| Lifecycle | — | — |
| Lifecycle milestones | — | 2019 Name change |
| Control system | — | — |
| Generation | — | — |
| Family | ASM AD 838 | MRSI HVM3 |
| Cited variants | ||
| Specifications | ||
| Configuration | 50/60 Hz[1] | — |
| Voltage | 230 Vac[1] | — |
| Phase | 1 Phase[1] | — |
| Power Consumption | 1300 w[6] | — |
| Wafer size | Wafer Loader[7] | — |
| Power | 1300 w[8] | — |
| Frequency | 50/60 Hz[9] | — |
| Wafer Sizes | 6 inch, 8 inch[2] | — |
| Application | — | Microwave modules, hybrid, optical modules, epoxy and eutectic die bonding[10] |
| Placement accuracy | — | 3 microns, 3 sigma, true radial placement (depending on application)[10] |
| Placement repeatability | — | ≤ 1 micron[10] |
| XY motors | — | Brushless DC linear motors with glass-scale encoder resolution of 50 nm[10] |
| X travel | — | 17.5 in (444.5 mm)[10] |
| Y travel | — | 36.0 in (914.4 mm)[10] |
| Z travel | — | 1.5 in (38.1 mm)[10] |
| Theta travel | — | 360°[10] |
| Theta resolution | — | 0.0045°[10] |
| Pressure control | — | 10 g to 5 kg per placement[10] |
| Cameras | — | 2 down-looking cameras sharing an optical path; 1 up-looking camera[10] |
| Vision system | — | Edge detection and pattern recognition[10] |
| Lighting | — | Red, green, and blue; ring or coaxial illumination; programmable intensity[10] |
| Pickup nozzles | — | 13 in standard nozzle changer; multiple changers optional; can also carry epoxy dispensing heads[10] |
| Waffle packs | — | Up to 72 2 x 2 in waffle packs (50.8 x 50.8 mm) or Gel-Paks™ or 4 x 4 in (101.6 x 101.6 mm)[10] |
| Tape and reel feeders | — | Up to ten 8 mm tape and reel feeders[10] |
| Eutectic bonding | — | Programmable ramp rate; maximum temperature 450°C[10] |
| Process gases | — | Nitrogen, argon, N2-H2, or Ar-H2[10] |
| Dispense pumps | — | 2 syringe rotary screw pumps or time/pressure-controlled pumps[10] |
| Dispense height sensing | — | 3-point laser height mapping of the substrate plane[10] |
| Dispense needle cleaning | — | Automated programmable cleaning between pattern dispense intervals[10] |
| Dispense needle calibration | — | Automatic software calibration using beam sensor[10] |
| Repeatability | — | ≤ 1 µm[10] |
| Minimum chip size | — | 0.008 sq. inch (200 sq. micron)[10] |
| Illumination | — | RGB; ring or coaxial; intensity programmable[10] |
| Eutectic temperature | — | up to 450ºC[10] |
| Minimum placement force (closed loop) | — | 10 g[10] |
| Maximum placement force (closed loop) | — | 5 kg[10] |
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