Comparison ledger
ASM ADL 838 LG 2, West Bond 10100, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | ADL 838 LG 2ASM | 10100West Bond |
|---|---|---|
| OEM | ASM | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | Wafer System: | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ASM ADL 838 | West Bond 10100 |
| Specifications | ||
| Wafer size | Wafer System:[1] | — |
| Configuration | 0 hours ran[1] | — |
| Input type | clamp ring / wafer expander[1] | — |
| PR system | full color, 256 grey levels[1] | — |
| Voltage | 100 - 240 VAC (single phase)[1] | — |
| Frequency | 50/60 Hz[1] | — |
| Full-load consumption | ~ 1,500 W[1] | — |
| UPH | 14,000+ (ASMPT in-house test)[1] | — |
| Die Size | 6 x 6 mil - 80 x 80 mil[1] | — |
| Flip Chip Handling | standard[1] | — |
| Length | 2.36" - 11.81"[1] | — |
| OEM | ASM[1] | — |
| Model | ADL 838 LG 2[1] | — |
| Category | Packaging & Bonding[2] | — |
| Tool type | Die bonder[1] | — |
| Wafer system | ASM ADL 838 family[2] | — |
| Pattern recognition system | full color, 256 grey levels[1] | — |
| Die size | 6 x 6 mil - 80 x 80 mil (0.15 x 0.15mm - 2.03 x 2.03mm)[1] | — |
| Die size without up-look inspection | 6 x 6 mil - 400 x 400 mil (0.15 x 0.15 mm - 10.16 x 10.16 mm)[1] | — |
| Substrate length | 2.36" - 11.81"[1] | — |
| Substrate width | 2.36" - 3.94"[1] | — |
| Substrate thickness | 5 - 118 mil[1] | — |
| Magazine length | 2.36" - 12.20"[1] | — |
| Magazine width | 2.36" - 4.33"[1] | — |
| Magazine height | 2.68" - 7.48"[1] | — |
| Bond force | Programmable (30 - 300g)[1] | — |
| Bond head | High force bond head[1] | — |
| Condition | 0 hours ran[1] | — |
| Width | 2.36" - 3.94"[1] | — |
| Thickness | 5 - 118 mil[1] | — |
| Height | 2.68" - 7.48"[1] | — |
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