Comparison ledger
ASML Twinscan NXT 1980 Di Immersion, EV Group 101, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 101EV Group | |
|---|---|---|
| OEM | ASML | EV Group |
| Category | Lithography | Lithography |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ASML Twinscan NXT 1980 Di Immersion | EV Group 101 |
| Specifications | ||
| Manufacturer | ASML[1] | — |
| Model | Twinscan NXT 1980 Di[1] | 101[5] |
| Category | Lithography[2] | — |
| Wafer size | 12 inch[1] | — |
| Platform architecture | NXT3 immersion technology[4] | — |
| Overlay accuracy | <1.5 nm (3σ)[4] | — |
| OEM | — | EV Group[5] |
| Equipment name | — | EVG 101 Spray Coater[5] |
| NEMO ID | — | evgspraycoat[5] |
| Training required | — | EVG 101 Training[5] |
| Training duration | — | 1.50 hours[5] |
| Processing technique | — | Resist Spray Coat (manual)[5] |
| Cleanliness | — | "All"[5] |
| Location | — | SNF Paul G Allen L107 Cleanroom[5] |
| Wafer diameter (substrate size) | — | up to 300 mm[6] |
| Available modules | — | Spin coat / OmniSpray® / develop[6] |
| Wafer handling options | — | Bowed / warped / thin wafer handling, edge handling[6] |
| Dispense options | — | Various resist dispense pumps covering viscosities up to 52000 cP; constant pressure dispense systems; EBR / BSR / pre-wet / bowl wash / liquid priming[6] |
| Processing technique (at SNF) | — | Resist Spray Coat (manual)[7] |
| Cleanliness group (at SNF) | — | "All"[5] |
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