Comparison ledger
Assembleon iFlex, Dek 03 iX Automatic, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | iFlexAssembleon | |
|---|---|---|
| OEM | Assembleon | Dek |
| Category | Assembly / SMT | Assembly / SMT |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Assembleon iFlex | Dek 03 iX Automatic |
| Cited variants | — | |
| Specifications | ||
| Placement Speed (max per hour) | 70,000 CPH (iFlex T4)[1] | — |
| Placement Accuracy | ±40 microns (chips); 35 microns (QFP); Cpk > 1[1] | — |
| Minimum Component Size | 0.4 x 0.2 mm (01005)[1] | — |
| Maximum Component Size | 17.5 x 17.5 x 15 mm (iFlex T4); 45 x 45 x 21 mm (iFlex T2); 120 x 52 x 25 mm (iFlex H1)[1] | — |
| Maximum Board Size | 525 x 558 mm (single lane); 525 x 254 mm (dual lane)[1] | — |
| Minimum Board Size | 50 x 50 mm[1] | — |
| Board Thickness | 0.3 to 6 mm[1] | — |
| Placement Quality | < 1 dpm (defects per million)[1] | — |
| Maximum Tape Feeding Positions (8 mm) | 64 single tapes, 128 twin tapes (iFlex T4/T2); 71 single tapes, 142 twin tapes (iFlex H1)[1] | — |
| Footprint (L x W) | 1,170 x 1,844 mm[1] | — |
| Data Interface | CamX[1] | — |
| Placement Force (Programmable) | 1.5 to 8 N (iFlex T4/T2); 4.0 to 30 N (iFlex H1)[1] | — |
| Maximum Component Height (Standard) | 15 mm (iFlex T4/T2); 25 mm (iFlex H1)[1] | — |
| Maximum Component Height (Optional) | 35 mm (iFlex T2)[1] | — |
| Vintage | — | 2020[2] |
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