Waferpedia

Comparison ledger

200 ACUversus2300 Exelan Flex

Axcelis 200 ACU, Lam Research 2300 Exelan Flex, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
200 ACUAxcelis
2300 Exelan FlexLam Research
OEMAxcelisLam Research
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAxcelis NV GSD 200Lam Research 2300
Specifications
ConfigurationParts Machine[1]50/60 Hz[5]
ManufacturerAxcelis[1]—
Model200 ACU[1]2300 Exelan Flex[6]
Tool typeAsher[1]—
Wafer size200mm[3]—
Serial numberAU6A356AH[3]—
Computer systemM 200 PC, M 200[4]—
Part numberSC 4572 A[4]—
Volts208[4]—
Amps30[4]—
Equipment typeAsher[1]Etch Chamber[6]
Wafer configuration8 inch[2]—
Voltage—208 VAC[5]
Full Load Current—56 A[5]
Main CB Current Rating—70 A[5]
Wafer Size—12 inch (300 mm)[6]
Frequency—50/60 Hz[5]
Make—Lam[6]
Wafer Sizes—12 inch[6]
Power—208 VAC, 50/60 Hz[5]
Vintage—2006[5]

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Sources (7)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]semistarcorp.comsemistarcorp.com
  3. [3]wotol.comwotol.com
  4. [4]semistarcorp.comsemistarcorp.com
  5. [5]inventory listing
  6. [6]Equipment inventory listing
  7. [7]Equipment inventory listing