Comparison ledger
Axcelis 200 ACU, Lam Research 9400, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 200 ACUAxcelis | 9400Lam Research |
|---|---|---|
| OEM | Axcelis | Lam Research |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Axcelis NV GSD 200 | Lam Research 9400 |
| Specifications | ||
| Configuration | Parts Machine[1] | — |
| Manufacturer | Axcelis[1] | — |
| Model | 200 ACU[1] | TCP 9400[5] |
| Tool type | Asher[1] | — |
| Wafer size | 200mm[3] | — |
| Serial number | AU6A356AH[3] | — |
| Computer system | M 200 PC, M 200[4] | — |
| Part number | SC 4572 A[4] | — |
| Volts | 208[4] | — |
| Amps | 30[4] | — |
| Equipment type | Asher[1] | — |
| Wafer configuration | 8 inch[2] | — |
| OEM | — | Lam Research[5] |
| Tool name | — | Lam Research TCP 9400 Poly Etcher[5] |
| Process category | — | Inductively Coupled Plasma Etching (ICP)[5] |
| Cleanliness group | — | Clean, Semiclean[5] |
| Use | — | for poly and Si etches[5] |
| Maximum etch depth | — | 3 um[5] |
| Process materials | — | Poly and Si[5] |
| Cleanliness | — | Clean, Semiclean[5] |
Plan your fab
Building a Etch process? Get a complete equipment list.
Open the fab equipment planner →