Waferpedia

Comparison ledger

200 ACUversusVersaline ICP Deep Silicon

Axcelis 200 ACU, Plasma-Therm Versaline ICP Deep Silicon, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
200 ACUAxcelis
OEMAxcelisPlasma-Therm
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAxcelis NV GSD 200Plasma-Therm Versaline ICP
Specifications
ConfigurationParts Machine[1]30 A, 4-Wire[5]
ManufacturerAxcelis[1]—
Model200 ACU[1]—
Tool typeAsher[1]—
Wafer size200mm[3]—
Serial numberAU6A356AH[3]—
Computer systemM 200 PC, M 200[4]—
Part numberSC 4572 A[4]—
Volts208[4]—
Amps30[4]—
Equipment typeAsher[1]—
Wafer configuration8 inch[2]—
Phase—208/220 VAC, 3 Phase[5]
Process type—Inductively coupled plasma etcher[5]
Application—Deep silicon etch[6]
Electrical requirements—208/220 VAC, 3 phase, 30 A, 4-wire, 50/60 Hz[5]
Compatible materials—Si[6]
Incompatible materials—III-V / Hi K / Metal[6]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]semistarcorp.comsemistarcorp.com
  3. [3]wotol.comwotol.com
  4. [4]semistarcorp.comsemistarcorp.com
  5. [5]inventory listing
  6. [6]research.utexas.eduresearch.utexas.edu