Waferpedia

Comparison ledger

200 ACUversusTE 8500 P Dry

Axcelis 200 ACU, Tokyo Electron TE 8500 P Dry, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
200 ACUAxcelis
TE 8500 P DryTokyo Electron
OEMAxcelisTokyo Electron
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAxcelis NV GSD 200Tokyo Electron TE 8500
Specifications
ConfigurationParts Machine[1]1 chamber[5]
ManufacturerAxcelis[1]—
Model200 ACU[1]—
Tool typeAsher[1]—
Wafer size200mm[3]6 inch[6]
Serial numberAU6A356AH[3]—
Computer systemM 200 PC, M 200[4]—
Part numberSC 4572 A[4]—
Volts208[4]—
Amps30[4]—
Equipment typeAsher[1]—
Wafer configuration8 inch[2]—
Gas—CF4, CHF3, He[5]
Chamber count—1[5]
Application—Oxide etch with endpoint[5]
Process gases—CF4, CHF3, He[5]
Operating system—EPROM based[5]
Pump—2ea, Kashiyama[5]
Vintage (reported)—1996 (some units 1999)[6]
Etch Type—Oxide etch with end point[5]
Gases—CF4, CHF3, He[5]
Operating System—EPROM based system[5]
Pump Make—Kashiyama (2 units)[5]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]semistarcorp.comsemistarcorp.com
  3. [3]wotol.comwotol.com
  4. [4]semistarcorp.comsemistarcorp.com
  5. [5]inventory listing
  6. [6]Equipment inventory listing