Waferpedia

Comparison ledger

22 AD 42versusCS30

Blanchard 22 AD 42, Logitech CS30, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
22 AD 42Blanchard
CS30Logitech
OEMBlanchardLogitech
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 22 AD 42Logitech CS30
Specifications
Phase3 Phase[1]—
Frequency60 Hz[1]—
Voltage120 Vac[1]—
ConfigurationNo coolant tank[1]—
Motor—240/110V, 50/60Hz; 0.25kw belt drive[2]
Blade—200mm diameter; 1.5mm thick; 22mm arbor; 1800 r.p.m[2]
Slide Size—2 of 28 x 48mm/26 x 46mm or 1 of 26 x 76mm[2]
Dimensions—530 x 240 x 300mm[2]
Net Weight—30kg[2]
Blade diameter—200mm[2]
Blade thickness—1.5mm[2]
Blade arbor—22mm[2]
Blade speed—1800 r.p.m[2]
Slide size capacity—2 of 28 x 48mm/26 x 46mm or 1 of 26 x 76mm[2]
Dimensions (W x D x H)—530 x 240 x 300mm[2]
Minimum specimen thickness (trimming)—500 µm[2]
Machine type—Compact trim saw[2]
Application—Thin section preparation[2]
Minimum trimming thickness—500 µm[2]
Chuck—Ceramic vacuum chuck[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]web.archive.orgweb.archive.org