Comparison ledger
Brooks 017-0146-01 Prealigner, EV Group EVG 40 NT, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 017-0146-01 PrealignerBrooks | EVG 40 NTEV Group |
|---|---|---|
| OEM | Brooks | EV Group |
| Category | Lithography | Lithography |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Brooks 017-0146-01 Prealigner | — |
| Specifications | ||
| Manufacturer | — | EV Group[1] |
| Model | — | EVG 40 NT[1] |
| Product type | — | Aligner[1] |
| Vintage | — | 2011[1] |
| Measurement scope | — | Lithography-relevant parameters and bond alignment accuracy[2] |
| Measurement methods | — | Critical dimension measurement, die-to-die alignment verification, multi-layer thickness measurement[2] |
| Tool format | — | Stand-alone tool[2] |
| Integrated module | — | AVM (HVM-integrated module)[2] |
| Application examples | — | Nanoimprint lithography and wafer-to-wafer bonding[2] |
| Verification capability | — | 100 nm bond overlay accuracy of EVG's GEMINI FB automated fusion bonding system[2] |
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