Waferpedia

Comparison ledger

100versusAP 300 E Lithography

CEE 100, Veeco AP 300 E Lithography, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
100CEE
OEMCEEVeeco
CategoryLithographyLithography
Wafer size6"Warped Wafer Handling to 500 um
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyCEE 100Veeco AP 300 E Lithography
Cited variants—
Specifications
Tool typeSpray Developer[1]—
Accepts wafer sizeup to 6" wafers[2]—
Programmable programs10 programs[2]—
Steps per programup to 10 steps[2]—
Programmable step parametersAcceleration, Speed, Time[2]—
Associated documentCEE Model 100CB Spinner.doc[2]—
Wafer sizeUp to 6 inches[2]Warped Wafer Handling to 500 um[3]
Programs10 programs each with up to 10 steps[2]—
Control parametersAcceleration, Speed, Time[2]—
Configuration—2.0 um Resolution, Extended Field, ghi-line Broadband Lens Dual 1200 Watt Lamp llluminator[3]
Universal Size/Warped Wafer Kit—200 mm and 300 mm[3]
Dual Flip Aperture—([68mm/44mm/34.2mm] x 26mm)[3]
Power Source—208 V three phase, 5 wire, 150 amp[3]
Resolution—2.0 µm[3]
Optics—extended-field, ghi-line broadband lens[3]
Illuminator—Dual 1200 Watt Lamp Illuminator[3]
Field size—68 x 26 mm[3]
Warped wafer handling—to 500 um[3]
Alignment system—PATMAX MVS Alignment System[3]
MVS alignment spectrum—530 - 570 nm[3]
Reticle stack—6 slot, manual front loading[3]
Reticle type—6 x 6 x 0.25 inch[3]
Wafer handling—Universal Size/Warped Wafer Kit: 200 mm and 300 mm[3]
Wafer thickness handling—0.4 mm to 2.0 mm[3]
Edge exposure system—WEE 3[3]
Edge exclusion system—one exclusion ring; exclusion ring width 1 - 5 mm protection available[3]
Communications—GEM HSMS[3]
Auto filter changer—ghi-line auto filter changer[3]
Open cassette adapter—QTY 2[3]
Environmental chamber—shipped from supplier (white)[3]
Lens protection—requires closed loop cooler[3]
Lens distortion reference—no lens matching[3]
Closed loop cooler—included[3]
Enhanced bottom pellicle—included[3]
Gen 4 Fanout 300—300mm wafer size only[3]

Plan your fab

Building a Lithography process? Get a complete equipment list.

Open the fab equipment planner →
Sources (3)Every fact above is drawn from these public sources
  1. [1]nanofab.ece.cmu.edunanofab.ece.cmu.edu
  2. [2]nanofab.utah.edunanofab.utah.edu
  3. [3]inventory listing