Comparison ledger
CHA SE-1000, CHA SSC-1000, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | SE-1000CHA | SSC-1000CHA |
|---|---|---|
| OEM | CHA | CHA |
| Category | Deposition | Deposition |
| Wafer size | 10 in. | 10 in. |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | CHA SE-1000 | CHA SSC-1000 |
| Specifications | ||
| System type | Sputtering System[1] | Sputtering System[2] |
| Wafer size | 10 in.[1] | 10 in.[2] |
| Configuration | — | Multi-station system[2] |
| Cathodes | — | Up to four RF or DC cathodes[2] |
| Operation | — | Sputter up or sputter down operation[2] |
| Fixture | — | Single-plane, multi-substrate rotating fixture[3] |
| Shutter | — | Rotating shutter for pre-deposition and positive thickness cutoff control[3] |
| Automation | — | Computer automation[3] |
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