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Comparison ledger

DAD 3230 Automatic Dicingversus15

Disco DAD 3230 Automatic Dicing, Lapmaster 15, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
15Lapmaster
OEMDiscoLapmaster
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco DADLapmaster 15
Specifications
Phase3 Phase[1]—
Configuration50/60 Hz[1]—
Voltage200V[1]—
OEMDisco[1]—
CategoryDicing & Grinding[2]—
Wafer size150 mm (Φ150 mm)[3]—
Spindle power1.5 kW[4]—
Objective lens7.5x[4]—
Automatic functionsAuto-alignment, auto-focus, auto-kerf check[2]—
Spindle lockShaft lock function for easier blade changing[2]—
Input Power—110 Vac[5]
Plate Diameter—15 inches (381 mm)[6]
Number of Conditioning Rings—3[6]
Ring ID—5.5 inches (140 mm)[6]
Standard RPM—60[6]
RPM Range (Variable Speed Drive)—0-60[6]
Drive Motor - Lapper—0.5 HP (0.37 kW)[6]
Drive Motor - Polisher—0.75 HP (0.56 kW)[6]
Length—25 inches (635 mm)[6]
Width—20 inches (508 mm)[6]
Height—24 inches (610 mm)[6]
Estimated Shipping Weight—285 lbs (129.3 kg)[6]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]web.archive.orgweb.archive.org
  4. [4]waferpedia.comwaferpedia.com
  5. [5]inventory listing
  6. [6]web.archive.orgweb.archive.org